Shenzhen Chinasky Laser Technology Co., Ltd gaw Miwa mungdan hta uv laser htu ai jak hpe grau kungkyang ai hku galaw shapraw ai hte garan jaw ai ni kaw na langai mi rai nga ai. Anhte a htingnu kaw na 2 ning garan ai uv laser cutting jak hpe mari la na matu myit simsa nga u. Customized order ni hpe mung hkap la ga ai.
Atsam hte akyu
Grai dam lada ai arung arai hte htuk manu ai lam
Kaga laser ni hte yak hkak ai arung arai ni hpe atsawm sha galaw lu ai, dai ni hta plastic, ceramics, glass, hte grai htoi tu ai magri hte aluminum zawn re ai nhprang rai ni lawm ai.
Rawt jat galu kaba wa ai shamu shamawt ai ladat ni
Hpaji rawng ai linear motor ni hte galvanometer scanner ni gaw, yak hkak ai htu ai lam ni a matu n bung ai lawan ai hte hkrak ai lam hpe jaw ya ai.
Hkrum zup ai shingran hkrang shapraw ai lam
Hpa majaw nga yang, n-gun ja ai camera ni gaw, PCB hte semiconductor arung arai ni a matu ahkyak ai hkrak ai lam hpe hkam la lu hkra, fiducial masat kumla (sh) hkrang ni hpe n-gun dat ai hpe shi hkrai shi tam nna, shingdaw ya ai.
Kaja dik htum galaw ai shara ni
460 mm x 460 mm kaba dik htum laser bungli galaw ai shara hpe panel kaba ni (sh) array law law a matu, 50 mm x 50 mm kaji-htuk manu ai hkrang shapraw ai shara hte rau. Ndai dual-range atsam gaw, shingdaw n lu ai n-gun atsam hpe jaw ya ai, kaba ai -format arung arai ni hpe galaw ai kaw nna, grai sawng ai, kaji ai arung arai ni hpe grai hkrak hkra galaw ai du hkra.
Hpaji rawng ai ladat Database
Hkum tsup ai database gaw, client ni hpe, arung arai shagu a matu laklai ai cutting parameter library ni hpe gawgap nna, shinggyin la lu shangun ai. Ndai lam gaw lata hte shut ai lam ni hpe yeng seng kau ya nna, operator a mahkrum madup hpe n sawn ai sha, mara n kap ai, bai galaw mai ai mahtai ni hpe lu la shangun ai.
Lawan dik ai hkrak hkrak shamu shamawt ai ladat (XY-Axis)
800 mm/s lawan ai hte 1G lawan ai hku galaw lu ai, n-gun ja ai-shamu shamawt ai platform hte hpaw da ai. Ndai gaw lawan ai hku shara jahkrat lu na matu madi shadaw ya nna, n-cutting idle time hpe grai shayawm ya lu ai, batch kaji kaba galaw shapraw ai lam a matu yawng hkra galaw lu ai atsam hte akyu rawng ai lam hpe grai jat ya lu ai.
Software bungli galaw ai lam hpe hkrak hkra galaw ai
Software interface hta "Lata la ai hku htu ai," "Hpaji - hpe madung tawn nna htu ai," hte "Arung arai-Laksan Parameter ni hpe tau hkrau masat da ai" zawn re ai asan sha chye na loi ai magam bungli ni lawm ai. Ndai lam gaw, yak hkak ai bungli ni hpe click loi mi hte galaw na matu asan sha galaw ya nna, operator sharin hkam la ai aten hpe shayawm ya lu ai hte shut ai lam ni hpe mung koi ya lu ai.
Automated galaw shapraw ai labau hte bai myit dum ai lam
Dai system gaw, arung arai shagu a matu, hkum tsup ai cutting data hpe shi hkrai shi ka matsing da ya ai. Bungli galai na matu, operator ni gaw list kaw na product mying hpe lata la nna, parameter yawng hpe kalang ta bai dum wa ai, lawan ai hku galai shai lu ai hte sakse hkam da ai product ni a matu setup shut ai lam ni hpe yeng seng kau lu ai.
Hpaji rawng ai bungli galaw ai ni hpe hparan ai lam hte jep joi ai lam hpe jaw ya ai
Atsam rawng ai yu reng ai arung arai ni hte uphkang ai ni. Dai system gaw, login/logout aten ni, parameter galai shai ai lam shagu, lang ai cut file ni a labau hpe tup hkrak ka da ai operator ni a bungli yawng hpe shi hkrai shi ka bang ya ai. Ndai gaw, hkum tsup ai hku hkan tam lu ai hte lit la lu ai lam hpe madi shadaw ya nna, quality control ana jep chyoi ai lam hta karum ya lu ai.
Shawk shawn ai
- Semiconductor hte IC hpe shinggyin tawn ai lam:Wafer dicing (singulation), silicon hpe htu ai, ceramic npu hpe htu ai, lead frame ni hpe galaw ai lam ni galaw ai.
- Galai shai mai ai wan jak (FPC):Flexible Printed Circuits (FPC), shingnip ni, hte n-gun n rawng ai polyimide (PI) hte PET shingnip ni hpe hkrak hkrak htu nna htu shaw ai lam galaw ai.
- Tengman ai hpaji hparat:N-gun n rawng ai hpri (copper, aluminum foils) ni hpe gang je kau nna, n-gun n rawng ai jak jak (MEMS) ni hpe galaw ai, n-gun rawng ai mesh hte filter ni hpe galaw ai.
- Hpaji lang ai Electronic:Camera module ni, hkra ai sensor ni, hte madun dan ai arung arai ni a matu glass hte safire hpe htu ai; smartphone a daw ni hpe masat da nna, gram lajang ai lam ni galaw ai.
FAQ
San: UV laser gaw CO2 (sh) fiber laser hte gara hku n bung ai hku cut galaw ai kun?
A: CO2 hte fiber laser ni gaw madung hku nna n-gun hpe lang nna, arai ni hpe n-gun dat (sh) n-gun dat dat ai raitim UV laser gaw photo-ablation ngu ai "katsi ai" ladat hpe lang ai. Shi a wavelength kadun ai hte photon n-gun kaba ai gaw, dai arai a molecular bonds ni hpe hkrak sha daw kau ya nna, grup yin de n-gun n law ai sha, arai hpe hkrak hkrak shaw kau ya ai.
San: UV laser gaw gara arai ni hpe kaja dik htum cut galaw lu ai kun?
A: UV lasers gaw n-gun n rawng ai hte yak hkak ai arung arai amyu myu hpe gang je kau lu ai hta grau kungkyang ai, dai hta lawm ai:
● Plastic & Polymer: Polyimide (PI), PET, PEEK, PTFE, hte kaga hpaji hparat hte seng ai plastic ni hpe lang ai.
● N-gun n rawng ai & Nhtoi hpe n shapraw ya ai Hpyen ni: Nhtoi hpe n shapraw ya ai magri, aluminum, ja, gumhpraw ni hpe lang ai.
● Ceramics: Alumina, zirconia, hte kaga npu na arung arai ni hta n-gun n rawng ai.
● Glass & Sapphire: San seng ai, hkang lu ai hku htu nna, n hkrat sum ai sha htu shaw la na matu.
● N-gun rawng ai arung arai ni: Silicon, gallium arsenide hte kaga n-gun rawng ai arung arai ni.
San: UV laser hte htu ai jak gaw kade daram hkrak ai kun?
A: UV laser hte htu ai jak a hkrak ai lam gaw grai tsaw ai. Kaji dik htum focal light spot gaw 20 um a lawu kaw rai mai nna, cutting edge gaw grai kaji ai. Machine ni gaw ±3 um daram shara jahkrat lu ai hte ±1 um bai nhtang galaw lu ai, ±20 um system processing hkrak lu ai.
San: "Cold cutting" galaw ai ladat a madung akyu ni gaw hpa ni rai kun?
A: Madung akyu ni gaw .
- No Thermal Damage: Wan hkru ai, hka lim ai, hte katsi ai-a majaw byin pru wa ai hkrang nsam hpe yeng seng kau ya ai.
- Superior Edge Quality: N-gun n rawng ai, n-gun rawng ai bunghku ni hpe shapraw ya ai.
- Minimal HAZ: Cut galaw ai shara grup yin na arung arai ni a hkam kaja lam hpe makawp maga ya ai.
- Katsi ai hpe gang je kau lu ai atsam-Sensitive Materials: Thermal laser ni hte jahten kau na arung arai ni hpe galaw lu ai atsam.
San: UV laser hte htu ai arung arai ni a matu n-gun n-gun (thickness range) gaw kade daram rai na kun?
A: UV laser ni hpe n-gun n rawng ai hte n-gun n rawng ai arung arai ni hta ultra-htuk manu ai bungli galaw na matu grau kaja hkra galaw da ai. Kaja dik ai n-gun gaw 1 micron kaw nna 1-2 mm du hkra rai nna, dai gaw dai arai a arawn alai hta hkan nna rai nga ai. Dai ni gaw, n-gun ja ai magri plate (sh) block ni hpe gang je kau na matu n galaw da ai.
San: UV laser system hpe lang na matu shim lum ai kun?
A: Teng sha re. Laser hpe shim lum ai hku shinggrup da ai cabinet kata hta tup hkrak shinggrup da ai majaw, bungli galaw ai shaloi, n kaja ai UV nhtoi n pru mat hkra galaw da ai. Operator ni gaw, n-gun n rawng ai sha, shim lum ai hku nna, daw ni hpe htaw bang nna jahkrat mai ai.
Hot Tags: uv laser htu jak, Miwa uv laser htu jak galaw shapraw ai ni, jaw ya ai ni, jak rung
Hpaji masa masat masa ni
|
Kasi |
HT -UVC15 |
|
Laser n-gun |
15 W |
|
Laser amyu |
UV nhtoi htoi ai |
|
Laser n-gun |
355 nm |
|
Ladat langai sha galaw ai ginra |
50×50 mm |
|
Yawng galaw ai lam |
460 mm × 460 mm (Tinang ra ai hku galai shai mai ai) |
|
CCD Shingrai-Hkrang Shapraw Ai Lam |
±3 μm |
|
Tinang hkrai-Myit maju jung ai magam bungli |
Mai sa |
|
XY-Axis hpe bai shara jahkrat ai hkrak ai lam |
±1 μm |
|
XY-Axis shara hpe hkrak hkrak masat da ai lam |
±3 μm |
|
Madi shadaw ai File Format ni |
DXF, DWG, GBR, CAD hte kaga ni |
